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GANGES TECHNOLOGY
Ferrite Chip Bead For High Current Applications
HCB Series
P1. www..com
High Current Chip Bead
1. Features
HCB/HPB-series for Large Current Application
HCB/HPB Series
The HCB/HPB series can be used in high current circuits due to its low DC resistance. It can match power lines to maximum of 6A DC.
2. Dimension
D
Chip size Size
1608
A(mm)
1.60.15 2.00.20 3.20.20 3.20.20 4.50.20 4.50.20 5.70.2
B(mm)
0.800.15 1.250.20 1.600.20 2.500.20 1.600.20 3.200.20 5.00.3
C(mm)
0.800.15 0.850.20 1.100.20 1.300.20 1.600.20 1.500.20 1.80.2
D(mm)
0.300.2 0.500.3 0.500.3 0.500.3 0.500.3 0.500.3 0.50.3
A
2012 3216 3225
C
4516
B
4532 5750
3. Part Numbering HCB
A A: Series B: Dimension C: Material D: Impedance E: Packaging F: Rated Current 301=300 , 300=30 T=Taping and Reel , B=Bulk(Bags) 10=1000mA=1A LxW
3216
B
K
C
-
301
D
T
E
10
F
4.Specification
Customer Part Number YOSONIC Part Number
HCB1608K-300T30 HCB1608K-800T30 HCB1608K-121T20 HCB1608K-151T20 HCB1608K-221T20 HCB1608K-301T10 HCB1608K-471T10 HCB1608K-601T10 HCB2012K-300T30 HCB2012K-800T30 HCB2012K-121T20 HCB2012K-151T20
Impedance Test Frequency Rated Current DCR (Ohm) (MHz) (mA) max. (Ohm) max.
3025% 8025% 12025% 15025% 22025% 30025% 47025% 60025% 3025% 8025% 12025% 15025% 100 100 100 100 100 100 100 100 100 100 100 100 3000 3000 2000 2000 2000 1000 1000 1000 3000 3000 2000 2000 0.04 0.04 0.10 0.10 0.10 0.20
Reference
For Large Current 0.20 0.20 0.04 0.04 0.10 0.10
P2. www..com Customer Part Number YOSONIC Part Number
HCB2012K-221T20 HCB2012K-301T10 HCB2012K-471T10 HCB2012K-601T10 HPB2012Z-300T50 HPB2012Z-101T40 HPB2012Z-221T30 HPB2012Z-331T25 HPB2012Z-471T20 HPB2012Z-601T15 HCB3216K-300T30 HCB3216K-500T30 HCB3216K-800T30 HCB3216K-121T20 HCB3216K-151T20 HCB3216K-301T10 HCB3216K-471T10 HCB3216K-501T30 HCB3216K-601T20 HCB3225K-600T40 HCB3225K-900T20 HCB3225K-151T50 HCB3225K-201T40 HCB4516K-600T60 HCB4516K-800T30 HCB4516C-102T15 HCB4532K-800T60 HCB4532K-131T30 HCB4532K-151T50 HCB4532H-681T40 HCB4532H-132T30 HCB4532M-132T30 HCB5750V-101T60 HCB5750V-151T30 HCB5750V-181T30 HCB5750H-601T30
Impedance Test Frequency Rated Current DCR (Ohm) (MHz) (mA) max. (Ohm) max.
22025% 30025% 47025% 60025% 3025% 10025% 22025% 33025% 47025% 60025% 30 25% 50 25% 80 25% 120 25% 150 25% 300 25% 470 25% 500 25% 600 25% 60 25% 90 25% 150 25% 200 25% 60 25% 80 25% 1000 25% 80 25% 130 25% 150 25% 68025% 1300 25% 1300 25% 100 25% 150 25% 180 25% 600 25% 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 60 100 100 100 100 100 2000 1000 1000 1000 5000 4000 3000 2500 2000 1500 3000 3000 3000 2000 2000 1000 1000 3000 2000 4000 2000 5000 4000 6000 3000 1500 6000 3000 5000 4000 3000 3000 6000 3000 3000 3000 0.10 0.20 0.20 0.20 0.01 0.02 0.04 0.05 0.08 0.10 0.04 0.04 0.04 0.10 0.10 0.20 0.20 0.04
Reference
For Large Current 0.10 0.03 0.10 0.02 0.03 0.01 0.04 0.15 0.01 0.04 0.02 0.03 0.06 0.06 0.01 0.04 0.04 0.04
5. Reliability and Test Condition
Item
Operating Temperature Storage temperature and humidity range Impedance
Performance
-55~+125 -55~+125 70%RH (max)
Test Condition
HP4291A, HP4287A+16092A
Refer to standard electrical characteristics list
DC Resistance Rated Current HP4338B
1000~6000mA (HCB), 1500~5000mA (HPB)
P3. Test Condition
Item
Performance
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Temperature Rise Test
30 max. (t)
1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer.
Preheating Dipping Natural cooling
Preheat:150,60sec.
260C
Solder : H63A Solder tamperature:2605 Flux: rosin
second second
Solder heat Resistance
Appearance: No significant abnormality. Impedance change: Within 30%.
150C
Dip time:100.5sec.
Preheating Dipping Natural cooling
Preheat:150,60sec. Solder : H63A Solder tamperature:2305 Flux: rosin
More than 90% of the terminal
Solderability
230C
electrode should be covered with solder.
150C second second
Dip time:41sec.
For HCB HPB: Size 1608 2012 3216 3225 4516 4532 5750 Force (Kfg) 0.5 0.6 1.0 1.0 1.0 1.5 2.0 >25 Time(sec)
The terminal electrode and the dielectric must
Terminal strength
W
not be damaged by the forces applied on the right conditions.
20(.787)
The terminal electrode and the dielectric must
Flexture strength
Bending
45(1.772) 45(1.772)
not be damaged by the forces applied on the right conditions.
Solder a chip on a test substrate, bend the substrate by 2mm (0.079in)and return.
40(1.575)
100(3.937)
Series name mm(inches) 1608 2012 3216 3225 0.80(0.033) 0.14(0.055) 2.00(0.079) 2.70(0.106)
P-Kgf 0.3 1.0 2.5 2.5
The ferrite should not be damaged by
Bending Strength
R 0.5(0.02)
Forces applied on the right condition.
A
4516 4532
Temperature:1255. Loading at High Temperature
Appearance: no damage. Impedance: within30%of initial value.
Applied current:rated current. Duration:50012hrs. Measured at room temperature after placing for 2 to 3hrs.
Humidity:90~95%RH. Temperature:402. Loading under Damp Heat
Appearance: no damage. Impedance: within30%of initial value.
Applied current: rated current. Duration:50012hrs. Measured at room temperature after placing for 2 to 3hrs.
Item
Performance
Test Condition
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Phase 1 Temperature() Time(min) -552 Room Temp. +1255 Room Temp. 303 10~15 303 10~15 Measured at room temperature after placing Measured:5 times for 2 to 3 hrs. Temperature:-552. Low temperature storage test For HCB HPB Condition for 1 cycle Step1:-552 Step3:+1255 Number of cycles:5 4 303 min. 303 min.
Appearance: no damage.
Thermal shock
Step2:Room temperature 10 to15 min. 2 3 Step4: Room temperature 10 to15 min.
Impedance: within30%of initial value.
Appearance: no damage. Impedance: within30%of initial value.
Applied current:rated current. Duration:50012hrs. Measured at room temperature after placing for 2 to 3hrs. Frequency: 10-55-10Hz for 1 min.
Random Vibration Test
Appearance: Cracking, shipping and any other defects harmful to the characteristics should not be allowed. Impedance: Within30% of initial value.
Amplitude: 1.52mm Directions and times: X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours).
Drop
Drop 10 times on a concrete floor from a height of 75cm
a: No mechanical damage b: Impedance change: 30%
6. Soldering and Mounting
6-1. Recommended PC Board Pattern
L
Chip size Series Type
1608 2012 3216 HCB/HPB 3225 4516 4532
Land Patterns For Reflow Soldering
A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm)
G
1.60.15 2.00.20 3.20.20 3.20.20 4.50.20 4.50.20
0.800.15 0.800.15 0.300.2 1.250.20 0.850.20 0.500.3 1.600.20 1.100.20 0.500.3 2.500.20 1.300.20 0.500.3 1.600.20 1.600.20 0.500.3 3.200.20 1.500.20 0.500.3
2.60 3.00 4.40 4.40 5.70 5.90
0.60 1.00 2.20 2.20 2.70 2.57
0.80 1.00 1.40 3.40 1.40 4.22
PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure.
6-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. YOSONIC terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 6-2.1 Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. 6-2.2 Solder Wave: Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave , typical at 240. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Figure 2. 6-2.3 Soldering Iron(Figure 3): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended.
Preheat circuit and products to 150 280 tip temperature (max) Never contact the ceramic with the iron tip 1.0mm tip diameter (max) Use a 20 watt soldering iron with tip diameter of 1.0mm Limit soldering time to 3 sec.
H
P6. www..com
PRE-HEATING SOLDERING NATURAL COOLING
P5.
PRE-HEATING
SOLDERING
NATURAL COOLING
PRE-HEATING
SOLDERING
NATURAL COOLING
TEMPERATURE C
TEMPERATURE C
0
0
Top cover tape
150 (302)
165 to180
150
0
230
TEMPERATURE C
230 (446)
250
F
The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions.
280 230 150
Room Temp. ()
Room Humidity (%)
Room atm (hPa) 860~1060
Over 1 min.
Tearing Speed mm/min 300
Gradual Cooling Within 3 sec.
Base tape
Over 1 min. Over 1 min. Within 10 sec. Gradual Cooling
5~35
Gradual Cooling Within 3 sec.
45~85
Over 2 min.
Figure 1. Re-flow Soldering
Figure 2. Wave Soldering
Figure 3. Hand Soldering
6-2.4 Solder Volume: Accordingly Increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side:
7. Packaging Information
7-1. Reel Dimension
A
13 .5 0 .5
20.5
Type
0.5
A(mm)
9.00.5 13.50.5
B(mm)
602 602
C(mm)
13.50.5 13.50.5
D(mm)
1782 1782
D
B
R1
C
R1 .9
R0.5
7"x8mm 7"x12mm
120
7"x8mm
7"x12mm
7-2.1 Tape Dimension / 8mm
P2:20.05 E:1.750.1
Po:40.1
1 D:
.5
. +0
1
A
t
Series
HCB
size
160808 201209 321611 322513
Bo(mm)
1.800.10 2.250.10 3.500.10 3.420.10
Ao(mm) Ko(mm) P(mm)
1.010.10 1.020.10 1.420.10 1.040.10 1.880.10 1.270.10 2.770.10 1.550.10 4.00.1 4.00.1 4.00.1 4.00.1
t(mm)
0.220.05 0.220.05 0.220.05 0.220.05
W:8.00.1
HCB,HPB
Bo
F:3.50.05
HCB HCB
1 0. :1 D1
P
A
Ao
Ko
SECTION A-A
7-2.2 Tape Dimension / 12mm
1.750.1 Po:40.1 P2:2.00.05 D:1.5+0.1 t
Series
5.50.05 W:12.00.1 Bo
Size
451616 453215 575018
Bo(mm) Ao(mm) Ko(mm) P(mm)
4.950.1 4.950.1 6.100.1 1.930.1 3.660.1 5.400.1 1.930.1 1.850.1 2.000.1 4.00.1 8.00.1 8.00.1
t(mm)
0.240.05 0.240.05 0.30
HCB HCB
D1:1.50.1
P Ao
Ko
HCB
7-3. Packaging Quantity Chip size
Chip / Reel Inner box Middle box Carton Bulk (Bags)
575018 453215
1000 4000 20000 40000 4000 1000 4000 20000 40000 12000
451616 322513
2000 8000 40000 80000 20000 2500 12500 62500 125000 30000
321611
3000 15000 75000 150000 50000
201209 160808
4000 20000 100000 200000 150000 4000 20000 100000 200000 200000
7-4. Tearing Off Force
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Typical Impedance v.s. Frequency Curve
HCB1608K-300T30
120 160
HCB1608K-800T30
300 250
HCB1608K-121T20
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
90
120
Z
80
200 150 100 50
60
Z
Z
30
40
X R
1 10 100 1000
0 1 10
R
100
X
0 1000 1 10
R
100
X
0 1000
FREQUENCY(MHz) HCB1608K-151T20
300 250 400
FREQUENCY(MHz) HCB1608K-221T20
400
FREQUENCY(MHz) HCB1608K-301T10 Z
IMPEDANCE(Ohm)
200 150 100 50 0 1 10
Z
200
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
300
Z
300
200
X
100
X R
100 1000
100
X R
R
0 100 1000 1 10 100 1000
0 1 10
FREQUENCY(MHz)
FREQUENCY(MHz)
FREQUENCY(MHz)
HCB1608K-471T10
800 800
HCB1608K-601T10 Z Z
HCB2012K-300T30
90
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
600
600
60
400
400
Z
30
200
200
X
X R
1 10 100 1000
X
0 1 10
R
100 1000
0
0 1 10
R
100 1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FREQUENCY(MHz) HCB2012K-151T20
400
HCB2012K-800T30
200
HCB2012K-121T20
300
160
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
120
Z
200
Z
IMPEDANCE(Ohm)
300
200
Z
80
100
40
X
100
X
0 1 10
R
100 1000
0 1 10
R
0 100 1000 1 10
R
100
X
1000
FREQUENCY(MHz) HCB2012K-221T20
600 600
FREQUENCY(MHz) HCB2012K-301T10
800
FREQUENCY(MHz) HCB2012K-471T10
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
600
400
400
Z
Z
Z
200
400
200
X R
0 1 10 100 1000
200
X
0 1 10
R
0 100 1000 1 10
R
100
X
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FREQUENCY(MHz)
HCB2012K-601T10
800
HPB2012Z-300T50
100 300 250
HPB2012Z-101T40
Z IMPEDANCE(Ohm)
80
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
600
200 150 100 50 0
60
400
Z
40
Z
200
20
X
0 1 10
X R
1 10 100 1000 10000
R
X
0
100 1000
R
1 10 100 1000 10000
FREQUENCY(MHz)
FREQUENCY(MHz)
FREQUENCY(MHz)
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Typical Impedance v.s. Frequency Curve
HPB2012Z-221T30
500 600
HPB2012Z-331T25
800
HPB2012Z-471T20
400
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
600
400
Z
300
Z
Z
400
200
200
200
100
X
0 1 10
X R
0 0 1 10 100 1000 10000 1 10
X R
100 1000 10000
R
100 1000 10000
FREQUENCY(MHz) HPB2012Z-601T15
800
FREQUENCY(MHz)
HCB3216K-300T30
120
150
FREQUENCY(MHz)
HCB3216K-500T30
Z
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
600
90
100
400
60
Z
50
Z
30
200
X R
X R
1 10 100 1000
X R
0 1 10 100 1000
0 1 10 100 1000 10000
0
FREQUENCY(MHz)
HCB3216K-800T30
160
360 300
FREQUENCY(MHz)
HCB3216K-121T20
300
FREQUENCY(MHz)
HCB3216K-151T20
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
120
Z
80
240 180 120 60
200
Z
Z
X
40
100
X
X R
1 10 100 1000
R
0 1 10 100 1000
0
R
0 1 10 100 1000
FREQUENCY(MHz)
HCB3216K-301T10
400 800
FREQUENCY(MHz)
HCB3216K-471T10
800
FREQUENCY(MHz) HCB3216K-501T30
Z
300 600 600
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
Z
400
Z
200
400
100
200
200
X R
0 1 10 100 1000 0 1 10
X R X
0 100 1000 1 10 100 1000
R
FREQUENCY(MHz)
FREQUENCY(MHz)
FREQUENCY(MHz)
HCB3216K-601T20
800
HCB3225K-600T40
200 160
HCB3225K-900T20
Z
160
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
600
120
Z
80
120
400
80
Z
X
40
200
40
X
R
0 1 10 100 1000
X
0 1 10
R
0 100 1000 1 10
R
100 1000
FREQUENCY(MHz)
FREQUENCY(MHz) HCB3225K-201T40
300
FREQUENCY(MHz) HCB4516K-600T60
200
HCB3225K-151T50
300
Z IMPEDANCE(Ohm)
200
160
IMPEDANCE(Ohm)
200
Z
IMPEDANCE(Ohm)
120
80
Z
100
100
X R
0 1 10 100 1000 0 1 10 100
X R
40
X R
1 10 100 1000
0 1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FREQUENCY(MHz)
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Typical Impedance v.s. Frequency Curve
HCB4516K-800T30
200 3000 2500
HCB4516C-102T15
200
HCB4532K-800T60
160
Z IMPEDANCE(Ohm)
160
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
2000 1500 1000 500
120
120
Z
80
Z
80
40
X
40
0 1 10
R
100 1000
R
0 1 10 100
X
1000
0 1 10
R
100
X
1000
FREQUENCY(MHz) HCB4532K-131T30
250 250
FREQUENCY(MHz) HCB4532K-151T50
1500
FREQUENCY(MHz) HCB4532H-681T40
200
200
1200
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
150
Z
150
Z
IMPEDANCE(Ohm)
900
Z
100
100
600
50
50
300
X
0 1 10
X
0
R
100 1000
R
1 10 100 1000
0 1 10
R
100
X
1000
FREQUENCY(MHz) HCB4532H-132T30
2000 2500
FREQUENCY(MHz) HCB4532M-132T30
250
FREQUENCY(MHz) HCB5750V-101T60
Z IMPEDANCE(Ohm) IMPEDANCE(Ohm)
1500
2000
200
Z
1500
IMPEDANCE(Ohm)
150
1000
Z
100
1000
500
500
50
X
R
0 1 10
X
100 1000
0 1 10
R FREQUENCY(MHz) HCB5750V-181T30
X
0 100 1000 1 10
R
100 1000
FREQUENCY(MHz) HCB5750V-151T30
250 300
FREQUENCY(MHz) HCB5750H-601T30
600
Z
200 500
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
200
Z
IMPEDANCE(Ohm) X
Z
150
400 300 200 100 0
100
X
50
100
R
1 10
X
100 1000
R
0 1 10 100 1000 0 1 10
R
100 1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FREQUENCY(MHz)

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